Electronic components & devices

 

Complete abrasive solutions for the electronics industry, from wafer and chip processing to LED’s, and manufacturing of optic electronic parts and device components.

 

Electronic components & devices

MAIN APPLICATIONS


  • Sizing of silicon bricks
  • Surface grinding and chamfering of Si blocks
  • Ingot cropping
  • Wafer slicing
  • Wafer edge grinding
  • Wafer back side grinding
  • Micro die cutting
  • LED substrate surface grinding

 

MAIN PRODUCTS


  • Diamond band saw
  • Diamond resin bond wheels
  • ID Saw, band saw
  • Diamond wire saw
  • Diamond metal bond and electroplated wheels
  • Resin and vitrified bond wheels
  • Diamond metal and resin bond cutting blades
  • Diamond resin bond wheels